Amd automotive Bureau: focus on three core areas
As the world's leading chip manufacturer, amd has been good at CPU and GPU for a long time in the past. In recent years, the rapid development of connection devices and the data intensive application of embedded artificial intelligence have promoted the continuous growth of the demand for efficient and adaptive high-performance computing solutions. In order to better meet the market demand, amd chose to acquire the world's leading FPGA company, Xilinx.
On February 16 this year, the merger was successfully completed. Amd thus built a powerful product portfolio of CPU + GPU + FPGA + adaptive SOC, which can meet the needs of traditional computing, accelerated computing and other different computing. Moreover, with the profound accumulation of salinus in wired and wireless communication, automobile, industry and testing, measurement and Simulation Markets, amd has also successfully expanded its business from PC and server to automatic driving, 5g communication, Internet of things and other scenarios.
What kind of synergy will the two companies have in the automotive field?
According to Ms. Tang Xiaolei, vice president of sales of AMD Greater China, at a media event a few days ago, in the automotive industry, amd focuses on three areas at this stage, namely, information entertainment, ADAS and automatic driving. Among them, information entertainment, as you can see, mainly focuses on the digitization in the cabin, which is also one of the mainstream reform trends in the automotive industry under the tide of intelligent.
Recently, amd announced that it has reached a cooperation with ekaton to jointly create an on-board computing platform for the next generation of electric vehicles. Through the integration of driver information module, head up display system, rear seat entertainment, multi screen display, multi zone voice recognition, high-end games and full 3D user experience, it gives users an innovative on-board experience. It is reported that the digital cockpit is also the first vehicle platform using amd Rapunzel embedded v2000 processor and AMD radeon RX 6000 series GPU. It is expected to be mass produced in the global market by the end of 2023.
As a processor specially designed by AMD for automotive on-board information entertainment and instrumentation, industrial edge, etc., the Ruilong embedded v2000 series processor can support up to 4 independent displays with 4K resolution at the same time because it is equipped with up to 8 CPU cores and 7 GPU computing units. Compared with the previous generation products, a single amd Ruilong embedded v2000 series processor provides twice the multi-threaded unit power consumption performance, the single threaded CPU performance is improved by 30%, and the graphics performance is improved by 40%.
In fact, as early as 2021, the ryzen rDNA 2 processor developed by AMD was successfully installed in Tesla's new model 3 and model y on-board infotainment systems. The achievement of this project is also a symbol of AMD's official entry into the automotive industry.
In the field of ADAS, AMD's solutions are widely used in various sensors and related application fields at the edge side, such as cameras, in vehicle monitoring, look around system, automatic parking, lidar, 4D radar, etc., as well as core domain control. Based on these solutions, amd can also provide relevant technical support for different application fields such as autonomous taxi and unmanned delivery to help accelerate the landing of high-level autonomous driving.
Amd salinus's vehicle specification level platform plays a key role in providing power for extremely advanced ad modules. These advanced modules have an increasing demand for high performance and high capacity to achieve high-speed data aggregation, preprocessing and distribution (DAPD) and computing acceleration.
Before being acquired by AMD, Xilinx's FPGA has been widely used in ADAS embedded controllers to process the perception data of cameras, 4D imaging radar, lidar, etc. According to relevant statistical data, the cumulative shipment of salinus in the automotive electronics field has exceeded 205 million, of which the shipment in the ADAS field has reached 80 million. Salinus is not only the main chip supplier for processing the data of the surround camera, but also plays an important role in the processors of the emerging 4D imaging radar and laser radar.
On August 17, at the AMD Xilinx technology day, amd demonstrated its next generation of intelligent electronic rearview mirrors. The demonstration is provided by Haikang automobile. The dual channel intelligent electronic rear external otoscope supports 2 channels of 2MP, 60fps input and 2 channels of OLED display output. Through amd MPSoC processing, ultra-low delay display can be realized. It can flexibly adapt to the installation requirements of the host factory and customize ISP IP.
Also on display are AMD's on-board multi-sensor fusion scheme, which is based on AMD's next-generation 7Nm process versal device. It can realize data channel processing of 4-way 2MP, 2-way 8mp 30fps cameras, 1-way laser radar and 1-way millimeter wave radar, realize accurate synchronization of multi-source time stamps and data frames, and flexibly adapt to different kinds of fusion methods.
As the latest version of gb-15084 national mandatory safety standard is about to be released and implemented, more and more vehicle manufacturers are planning new electronic rearview mirror systems. Based on the advantages of adaptability, low delay, scalability and customization, amd Xilinx's automotive FPGA family can not only meet the current mass production ECU requirements of CMS, but also meet the future expansion requirements for cross domain integration capabilities.
In consideration of the slowdown of Moore's law, AMD is also constantly developing more advanced chiplet and 3D packaging technology, and helping customers use these advanced packaging to help intergenerational gain, instead of just improving product performance through the improvement of technology nodes.
"Now we are more and more using package improvement or chip integration, including rfsoc mentioned above, that is, integrating some analog things into the chip to achieve the performance gain that cannot be achieved or is relatively slow among the technical nodes." Tang Xiaolei said.
In addition to continuing to promote product innovation, Tang Xiaolei said that AMD is also actively strengthening platform innovation, including promoting hardware free compilation, launching heterogeneous software platforms for the increasing demand of heterogeneous computing, and providing service support in other advanced software and middleware to continuously empower customers to innovate.